Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers

Noriyuki Kuwano; Sadanori Horikami; Marina Linus

doi:10.4028/www.scientific.net/MSF.827.341

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HomeMaterials Science ForumMaterials Science Forum Vol. 827Electron Microscopy Study of Grain Boundary...

Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers

Abstract:

The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed in-situ in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers.

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Periodical:

Materials Science Forum (Volume 827)

Pages:

341-346

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.827.341

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Online since:

August 2015

Authors:

Noriyuki Kuwano*, Sadanori Horikami, Marina Linus

Keywords:

Deformation, Electron Microscopy, Grain Boundary, Pb-Free Solder, Re-Crystallization, Tin-Whisker

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* - Corresponding Author

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