In this paper, we discuss how finite element analysis (FEA) can be used to simulate certain micro electro mechanical systems (MEMS). The mechanical behavior of many MEMS devices is a direct result of non-mechanical physical phenomena, such as electrostatics, electromagnetics or heat transfer. This coupling of mechanical behavior with other physical effects, combined with considerations associated with their small dimensions, poses significant challenges to the analysis of MEMS. These challenges can be met by FEA software capable of performing multiphysics analysis with no limitations on the dimensions of the objects in a model. With such software at their disposal, engineers can use the results of their simulations to design MEMS devices.