Issue 46, 2014

An extremely rapid dip-coating method for self-assembly of octadecylphosphonic acid and its thermal stability on an aluminum film

Abstract

We introduce a dip-coating method for preparing self-assembled monolayers (SAMs) of octadecylphosphonic acid (OPA) on hydrophilic substrates by selecting anisole (methoxybenzene) as the solvent, which has a dielectric constant of 4.3. We demonstrate that full-coverage OPA SAMs are formed in a couple of seconds on a cleaved mica substrate upon its dipping in a 1 mM OPA solution in anisole. In order to develop applications of this extremely rapid coating approach in surface engineering, we investigate the thermal stability of OPA SAMs dip-coated on a UV/ozone-cleaned aluminum film using water contact angle measurements and time-of-flight secondary ion mass spectrometry. It was clarified that the OPA SAMs annealed in air at up to 200 °C exhibited excellent hydrophobicity and the degradation mechanism is oxidation of the alkyl chains.

Graphical abstract: An extremely rapid dip-coating method for self-assembly of octadecylphosphonic acid and its thermal stability on an aluminum film

Article information

Article type
Paper
Submitted
09 Sep 2014
Accepted
07 Oct 2014
First published
08 Oct 2014

J. Mater. Chem. C, 2014,2, 9941-9948

Author version available

An extremely rapid dip-coating method for self-assembly of octadecylphosphonic acid and its thermal stability on an aluminum film

D. Chen, H. K. Yin Wu, S. Naderi-Gohar, Y. Wu, Y. Huang and H. Nie, J. Mater. Chem. C, 2014, 2, 9941 DOI: 10.1039/C4TC02017K

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