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Lamination based embossing technique for LTCC

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Abstract

This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.

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Acknowledgments

The authors gratefully acknowledge the support and assistance from Heraeus thick film business unit. The financial support of the Engineering and Physical Sciences Research Council (EPSRC) is also acknowledged through the funding from the Innovative electronics Manufacturing Research Council (IeMRC) under the flagship project “Smart Microsystems”.

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Correspondence to Stefan P. Wilhelm.

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Wilhelm, S.P., Kay, R.W., Mohammed, M.I. et al. Lamination based embossing technique for LTCC. Microsyst Technol 19, 801–807 (2013). https://doi.org/10.1007/s00542-012-1702-y

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  • DOI: https://doi.org/10.1007/s00542-012-1702-y

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