Abstract
This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.
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References
Andrijasevic D, Smetana W, Zehetner J, Zoppel S (2007) Aspects of micro structuring low temperature co-fired ceramic (LTCC) for realisation complex 3D objects by embossing. Microelect Eng 84(5–8):1198–1201
Bartsch H, Albrecht A, Hoffmann M, Müller J (2011) Microforming process for embossing of LTCC tapes. J Micromech Microeng 22(1):015004
Belavic D, Hrovat M, Zarnik M, Holc J, Cilensek J, Jerlah M, Macek S, Ursic H, Kosec M (2008) PZT thick films for pressure sensors: Characterisation of materials and devices. In: Electronics system-integration technology conference, 2008. ESTC 2008. 2nd, pp 989–994
Birol H, Maeder T, Jacq C, Straessler S, Ryser P (2005) Fabrication of low-temperature co-fired ceramics micro-fluidic devices using sacrificial carbon layers. Int J App Cer Technol 2(5):364–373
Fercher G, Smetana W, Vellekoop M (2008) Contactless conductivity detection in LTCC technology for microfluidic devices. In: Electronics technology, 2008. ISSE ‘08. 31st International Spring Seminar, pp 324–328
Kay RW, Desmulliez MPY (2012) A review of stencil printing for microelectronic packaging. Soldering Surf Mt Technol 24(1):38–50
Kay RW, Stoyanov S, Glinski G, Bailey C, Desmulliez MPY (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. Com Pack Technol IEEE Trans Pack Technol 30(1):129–136. ISSN: 1521–3331
Kim HJ, Kim YJ, Kim JR (2006) An integrated LTCC inductor embedding NiZn ferrite. Magn IEEE Trans 42(10):2840–2842
Klumbies H, Partsch U, Goldberg A, Gebhardt S, Keitel U, Neubert H (2009) Actuators to be integrated in low temperature cofired ceramics (LTCC) microfluidic systems. In: 32nd International Spring seminar on electronics technology, ISSE 2009, pp 1–4
Lacrotte Y, Amalou F, Yu W, Desmulliez MPY (2009) Micro-Patterning of green tape ceramic using powder-blasting for LTCC manufacturing. IMAPS CICNT, Denver, pp 1–8
Xuechuan S, Maw HP, Tjeung RT, Ling SH, Lu CW, Jachowicz R (2008) Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing. Microsyst Technol 14(9):1405–1409
Acknowledgments
The authors gratefully acknowledge the support and assistance from Heraeus thick film business unit. The financial support of the Engineering and Physical Sciences Research Council (EPSRC) is also acknowledged through the funding from the Innovative electronics Manufacturing Research Council (IeMRC) under the flagship project “Smart Microsystems”.
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Wilhelm, S.P., Kay, R.W., Mohammed, M.I. et al. Lamination based embossing technique for LTCC. Microsyst Technol 19, 801–807 (2013). https://doi.org/10.1007/s00542-012-1702-y
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DOI: https://doi.org/10.1007/s00542-012-1702-y